Hardware
Compact edge AI modules for robotics and autonomous systems. Two points on the Qualcomm curve, one software stack, and the integration work already finished.
Qualcomm Dragonwing QCS8550
Qualcomm's 4 nm QCS8550, kernel 5.15, with 12 GB of LPDDR5X, 128 GB of UFS 4.0, and three 4-lane MIPI CSI-2 camera inputs.
Qualcomm Dragonwing Q-8750 (CQ8750S)
Qualcomm's 3 nm Q-8750, kernel 6.6, with 24 GB of LPDDR5X, 256 GB of UFS 4.0, and four GMSL camera inputs.
Side by side
| Specification | MVue 8550Shipping now | |
|---|---|---|
| Processor | ||
| SoC | Dragonwing QCS8550 | |
| Process | 4 nm | |
| CPU | Kryo, 8-core, up to 3.2 GHz | |
| GPU | Adreno 740, up to 680 MHz | |
| NPU | Hexagon V73 | |
| ISP | Spectra 780 | |
| Memory | ||
| RAM | 12 GB LPDDR5X | |
| Storage | 128 GB UFS 4.0 | |
| AI performance | ||
| Dense INT8 | 48 TOPS | |
| On-device LLM | Up to 8B | |
| Camera | ||
| Inputs | 3x MIPI CSI-2, 4-lane D-PHY | |
| Video | ||
| Decode | 4K240 / 8K60 | |
| Encode | 4K120 / 8K30 | |
| I/O | ||
| USB | USB 3.1 Gen 2 Type-C | |
| CAN | CAN FD | |
| Serial | 2x UART | |
| Expansion | 2x I2C, 1x SPI, 8x GPIO (expandable) | |
| Fan | PWM control | |
| Software | ||
| Kernel | 5.15 | |
| Environment | ||
| Temperature | -35 °C to +75 °C | |
Further customization available: Wi-Fi 7, PCIe, and additional I/O to your requirements.
Need mechanical drawings, confirmed module configurations, or lead times? Ask us directly.
How you ship on it
The platform work is done before the module reaches you.
Boot, drivers, cameras, and the AI runtime, brought up and validated.
Your code goes into the build. Cameras and I/O come through interfaces that already work.
Build, flash, and iterate on the device from day one.
Custom
These modules exist because we did the platform work first. A different form factor, sensor set, I/O mix, or silicon is the same work applied to your requirements — not a new problem.